|
For most Intergrated Circuits (ICs) the standard off the shelf electronic packages have adequate functionality to meet the IC packaging requirements. ISMAT’s patented IC packaging technology, US Patent number 7,105,931 B2 (other patents are pending), is based on developing the electronic package substrate as per the requirements of the IC and its operating environment when standard solutions are not adequate. An electronic package substrate can be designed and developed with special materials for specific requirements. |
|