For most Intergrated Circuits (ICs) the standard off the shelf electronic packages have adequate functionality to meet the IC packaging requirements.  ISMAT’s patented IC packaging technology, US Patent number 7,105,931 B2 (other patents are pending), is based on developing the electronic package substrate as per the requirements of the IC and its operating environment when standard solutions are not adequate.  An electronic package substrate can be designed and  developed with special materials for specific requirements.

 
     
 

The electronic substrates can be modified to address:

 
 
  • Thermal performance issues
  • Wire bondable and flip chip requirements
  • EMI / RF Issues
  • Form factor issues
    Constrained space requirements. For example, in cell phones
  • Challenging Environments
    For example, ICs used in very hot and corrosive environments such as, under the hood automotive applications
  • New types of applications
    • MEMs
    • CMOS sensors
    • Integrating multiple types of products such as ASICs and MEMs into a single electronic package
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